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The soldering material is used mainly in the electronics industry, for the production of standard devices and electronic components, in electrotechnology, and for soldering components with coatings of tin, tin-lead, cadmium, zinc and silver.
Specification:
- Tin content: 59% ~ 61%
- Lead content: remainder
- Antimony content: 0.3% ~ 0.8%
- Copper content: 0.03%
- Bismuth content: 0.03%
- Arsenic content: 0.02%
- Iron content: 0.02%
- Aluminum content: 0.002%
- Cadmium content: 0.002%
- Zinc content: 0.002%
- Sulfur content: 0.015%
- Minimum purity of the used raw materials: 99.9%
- Melting temperature: 183 ~ 215C
- Operating temperature: 330 ~ 380C
- Diameter: 1.0mm
- Weight: 250g
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