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The paste is intended for soldering SMD elements in production processes that do not take into account washing phases. Based on No Clean flux, which does not require washing, the remains of which do not cause corrosion centers. The product works with all lead-free alloys, is characterized by good adhesion and wettability of the soldered surface. It does not lose its physicochemical properties even after 20 hours of leaving it on the PCB. This time depends on the conditions in the room: humidity and temperature. Contains rosin-based flux The presence of an activator to prevent bubble formation air in soldered joints These connections have very good mechanical and electrical properties If the process includes a washing phase, this can be done with commonly available means (Water PCB cleaner, Alcohol PCB cleaner). Specifications: Manufacturer: AG TermoPasty Packaging: Syringe 1.4 ml
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